西安紫光国芯半导体股份有限公司Xi’an UniIC Semiconductors Co., Ltd.

西安紫光国芯半导体股份有限公司前身为成立于2004年德国英飞凌西安研发中心的存储事业部，2006年分拆成为独立的奇梦达科技西安有限公司，2009年被浪潮集团收购转制成为国内公司并更名为西安华芯半导体有限公司。2015年，紫光集团紫光国芯微电子股份有限公司收购西安华芯半导体有限公司并更名为西安紫光国芯半导体有限公司。2019年12月，经过重组，西安紫光国芯半导体并入北京紫光存储科技有限公司。2022年紫光集团实控人变更为智广芯控股，随着紫光集团重整完毕，西安紫光国芯踏上发展新征程。

公司是以DRAM（动态随机存取存储器）存储技术为核心的产品和服务提供商，核心业务包括标准存储芯片，模组和系统产品，嵌入式DRAM和存储控制芯片，以及专用集成电路设计开发服务，产品包括DRAM KGD、DRAM颗粒、DRAM模组、系统产品和设计服务。目前公司员工人数超过600名，其中研发工程师占比80%以上，70%拥有硕士或博士学位。公司还拥有二十余位外籍专家和海外留学归国人员。

Xi’an UniIC Semiconductors Co., Ltd. (“Xi’an UniIC” in short) was originally the Memory Division of Xi’an R&D Center of Infineon Technologies established in 2004. The memory division became an independent company Qimonda Technologies (Xi’an) Co., Ltd. after its spin-off in 2006. The entity was acquired by Inspur Group due to Qimonda worldwide insolvency and started as a local company Xi’an Sinochip Semiconductors Co., Ltd. in 2009. In 2015, the company was taken over by Tsinghua Unigroup and renamed as Xi’an UniIC. It became a share-holding company and begins a new era of development in 2023.

Xi’an UniIC is a product and service provider focusing on DRAM (Dynamic Random Access Memory) technologies. Its core business includes standard memory chips, module and system products, embedded DRAM and memory controller chips, as well as ASIC design services. The company has advanced R&D capabilities, rich experience in design, testing and mass production, as well as a well-established product development process and quality management system. The complete product portfolio and category include DRAM KGD, DRAM components, MCP, and DRAM modules, which have filled the gap of many high-end products in the domestic semiconductor memory industry.

Meanwhile, Xi’an UniIC has successfully developed the embedded DRAM chips with ultra-high bandwidth, ultra-large density and ultra-low power consumption; multiple high-performance SoC chips stacked with this embedded DRAM chip using WoW technology have achieved mass production and volume shipment in the past a couple of years. These achievements have also been invited to industry top journals and meetings such as IEDM 2020, CICC 2021, IMW 2021, A-SSCC 2021, ISSCC 2022 and VLSI 2023 to deliver reports and papers. 

Xi'an Headquarters

Tel：+86 (0)29 8831 8000   

Fax：+86 (0)29 8845 3299

E-mail：info@unisemicon.comAddress: F/4,Building A, 6th Road, High-tech Development Zone, Xi'an, 710075 China